US 12,068,553 B2
Flat conductor connection element
François Hermange, Aachen (DE); and Bernhard Reul, Herzogenrath (DE)
Assigned to SAINT-GOBAIN GLASS FRANCE, Courbevoie (FR)
Appl. No. 17/797,975
Filed by SAINT-GOBAIN GLASS FRANCE, Courbevoie (FR)
PCT Filed Feb. 5, 2021, PCT No. PCT/EP2021/052872
§ 371(c)(1), (2) Date Aug. 5, 2022,
PCT Pub. No. WO2021/156480, PCT Pub. Date Aug. 12, 2021.
Claims priority of application No. 20156266 (EP), filed on Feb. 7, 2020.
Prior Publication US 2023/0048545 A1, Feb. 16, 2023
Int. Cl. H05K 1/02 (2006.01); H01R 4/70 (2006.01); H01R 12/62 (2011.01); H01R 12/73 (2011.01); H01R 24/30 (2011.01); H01R 24/48 (2011.01); H01R 43/02 (2006.01); H01R 43/16 (2006.01); H01R 43/20 (2006.01); H05K 3/14 (2006.01)
CPC H01R 12/62 (2013.01) [H01R 4/70 (2013.01); H01R 43/02 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flat conductor connection element for an electrically conductive structure, applied to a pane, with the flat conductor connection element comprising:
at least one conductor, containing a flat conductor, having a first connection region at a first end and a second connection region at a second end, wherein the first connection region has a connection surface for the electrical connection to the electrically conductive structure and a contact surface opposite the connection surface for physical contact with a soldering tool, and
an encapsulation layer made of an electrically insulating material, which encapsulation layer surrounds the at least one conductor at least in a conductor section containing the first connection region, wherein the encapsulation layer has a through-hole, through which the connection surface and the contact surface of the first connection region are accessible, wherein, in a view perpendicular through a plane of the encapsulation layer, the first connection region of the conductor is situated within the through-hole.