US 12,068,552 B2
Circuit board assembly
Shinya Kawakita, Tokyo (JP); Shiro Yamashita, Hitachinaka (JP); and Toshikazu Shigyo, Hitachinaka (JP)
Assigned to Hitachi Astemo, Ltd., Hitachinaka (JP)
Appl. No. 17/632,918
Filed by Hitachi Astemo, Ltd., Hitachinaka (JP)
PCT Filed Jun. 5, 2020, PCT No. PCT/JP2020/022393
§ 371(c)(1), (2) Date Feb. 4, 2022,
PCT Pub. No. WO2021/024601, PCT Pub. Date Feb. 11, 2021.
Claims priority of application No. 2019-144052 (JP), filed on Aug. 5, 2019.
Prior Publication US 2022/0271453 A1, Aug. 25, 2022
Int. Cl. H01R 12/58 (2011.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01)
CPC H01R 12/585 (2013.01) [H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/1059 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A circuit board assembly comprising:
a circuit board;
a through-hole into which a press-fit terminal portion is inserted in a depth direction;
an inner wall land provided on an inner wall of the through-hole; and
a plurality of inner layer lands which are provided in an inner layer of the circuit board, are planes substantially parallel to a mounting surface of the circuit board, and are in contact with the inner wall land,
wherein
the inner wall land has a first region that is in contact with the press-fit terminal portion and a second region that is not in contact with the press-fit terminal portion, and
among the plurality of inner layer lands, a first inner layer land, which is an inner layer land aligned with the first region of the inner wall land, is wider than a second inner layer land which is an inner layer land aligned with the second region of the inner wall land.