US 12,068,525 B2
Integrated circuit packages, antenna modules, and communication devices
Sidharth Dalmia, Portland, OR (US); and Trang Thai, Hillsboro, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 7, 2022, as Appl. No. 17/938,768.
Application 17/938,768 is a continuation of application No. 15/991,295, filed on May 29, 2018, granted, now 11,509,037.
Prior Publication US 2023/0035608 A1, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/66 (2013.01); H01Q 9/0407 (2013.01); H01Q 21/065 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15311 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic assembly, comprising:
an antenna module, including:
an integrated circuit (IC) package, wherein the IC package includes a die coupled to a package substrate;
an antenna patch support coupled to the package substrate on a side of the package substrate opposite to the die, wherein the antenna patch support includes a first surface and an opposing second surface, the package substrate is coupled to the first surface and the second surface has a plurality of recesses therein; and
a plurality of antenna patches coupled to the antenna patch support, wherein at least some antenna patches in the plurality of antenna patches are over corresponding ones of the plurality of recesses.