US 12,068,443 B1
Forming conformable layer with flap on semiconductor devices
Oscar Torrents Abad, Cork (IE); Tilman Zehender, Cork (IE); Pooya Saketi, Cork (IE); and Karsten Moh, Saarbrucken (DE)
Assigned to META PLATFORMS TECHNOLOGIES, LLC, Menlo Park, CA (US)
Filed by META PLATFORMS TECHNOLOGIES, LLC, Menlo Park, CA (US)
Filed on Sep. 9, 2021, as Appl. No. 17/470,603.
Application 17/470,603 is a division of application No. 16/263,477, filed on Jan. 31, 2019, granted, now 11,145,797.
Claims priority of provisional application 62/668,728, filed on May 8, 2018.
Int. Cl. H01L 33/14 (2010.01); H01L 33/26 (2010.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 33/14 (2013.01); H01L 33/26 (2013.01); H01L 33/502 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A device comprising:
a light emitting diode (LED) comprising an epitaxial structure including a light emitting structure and a light emitting surface, the light emitting structure configured to emit light toward the light emitting surface; and
a conformable interface layer including a body portion on the light emitting surface and a conformable flap on the body portion, a width of the conformable flap being larger than a width of the body portion and larger than a width of the epitaxial structure.