US 12,068,430 B2
System and method for repairing vacancies resulting from mass transfer of devices
Evgeniy Bart, Santa Clara, CA (US); Yunda Wang, Milpitas, CA (US); and Matthew Shreve, Mountain View, CA (US)
Assigned to Xerox Corporation, Norwalk, CT (US)
Filed by Palo Alto Research Center Incorporated, Palo Alto, CA (US)
Filed on Apr. 19, 2021, as Appl. No. 17/234,173.
Prior Publication US 2022/0336696 A1, Oct. 20, 2022
Int. Cl. H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01)
CPC H01L 33/0095 (2013.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0066 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method, comprising:
identifying a target substrate comprising an array of chips on a carrier with a plurality of vacancies;
identifying a plurality of donor coupons that are incompletely filled with functional chips;
defining a bounding box that encompasses the vacancies on the target substrate;
simulating a plurality of outcomes by overlapping a representation of the bounding box over a representation of each of the plurality of donor coupons at a plurality of translational offsets on a substrate plane to determine matches between the vacancies of the target and the functional chips on the donor coupons;
determining an optimal one of the outcomes at a selected one or more of the donor coupons corresponding one or more offsets; and
performing a parallel transfer of the matching functional chips to fill the vacancies on the target substrate using the one or more selected donor coupons and corresponding one or more offsets.