CPC H01L 33/0095 (2013.01) [H01L 21/6835 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0066 (2013.01)] | 17 Claims |
1. A method, comprising:
identifying a target substrate comprising an array of chips on a carrier with a plurality of vacancies;
identifying a plurality of donor coupons that are incompletely filled with functional chips;
defining a bounding box that encompasses the vacancies on the target substrate;
simulating a plurality of outcomes by overlapping a representation of the bounding box over a representation of each of the plurality of donor coupons at a plurality of translational offsets on a substrate plane to determine matches between the vacancies of the target and the functional chips on the donor coupons;
determining an optimal one of the outcomes at a selected one or more of the donor coupons corresponding one or more offsets; and
performing a parallel transfer of the matching functional chips to fill the vacancies on the target substrate using the one or more selected donor coupons and corresponding one or more offsets.
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