US 12,068,422 B2
Systems and methods for cooling electronics
Craig R. Bibeau, Shakopee, MN (US); and Jason Graham, Prior Lake, MN (US)
Assigned to Simmonds Precision Products, Inc., Vergennes, VT (US)
Filed by Simmonds Precision Products, Inc., Vergennes, VT (US)
Filed on Oct. 8, 2021, as Appl. No. 17/497,874.
Prior Publication US 2023/0112805 A1, Apr. 13, 2023
Int. Cl. H01L 31/024 (2014.01); H01L 23/427 (2006.01); H01L 23/473 (2006.01)
CPC H01L 31/024 (2013.01) [H01L 23/427 (2013.01); H01L 23/473 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A thermal management system for an electronics assembly, comprising:
a reservoir housing a compressible fluid in a compressed state;
a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid;
a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice; and
an exhaust path fluidly connecting the heat exchange volume to an ambient environment external to the volume via an exhaust path outlet, wherein the reservoir includes a passive pressure release mechanism configured to retain the compressible fluid at a first predetermined pressure and configured to allow discharge of the compressible fluid at a second predetermined pressure.