US 12,068,351 B2
Solid-state image pickup device
Mineo Shimotsusa, Machida (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 23, 2023, as Appl. No. 18/322,239.
Application 14/856,354 is a division of application No. 13/808,877, granted, now 9,166,090, issued on Oct. 20, 2015, previously published as PCT/JP2011/003796, filed on Jul. 4, 2011.
Application 18/322,239 is a continuation of application No. 17/505,039, filed on Oct. 19, 2021, abandoned.
Application 17/505,039 is a continuation of application No. 16/777,586, filed on Jan. 30, 2020, granted, now 11,177,310, issued on Nov. 16, 2021.
Application 16/777,586 is a continuation of application No. 16/242,835, filed on Jan. 8, 2019, granted, now 10,573,680, issued on Feb. 25, 2020.
Application 16/242,835 is a continuation of application No. 15/894,258, filed on Feb. 12, 2018, granted, now 10,217,786, issued on Feb. 26, 2019.
Application 15/894,258 is a continuation of application No. 15/456,386, filed on Mar. 10, 2017, granted, now 9,929,202, issued on Mar. 27, 2018.
Application 15/456,386 is a continuation of application No. 15/209,605, filed on Jul. 13, 2016, granted, now 9,640,581, issued on May 2, 2017.
Application 15/209,605 is a continuation of application No. 14/856,354, filed on Sep. 16, 2015, granted, now 9,419,030, issued on Aug. 16, 2016.
Claims priority of application No. 2010-156926 (JP), filed on Jul. 9, 2010.
Prior Publication US 2023/0299112 A1, Sep. 21, 2023
Int. Cl. H01L 27/146 (2006.01); H01L 31/09 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14601 (2013.01); H01L 27/14634 (2013.01); H01L 27/1464 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 27/1469 (2013.01); H01L 31/09 (2013.01); H01L 27/14621 (2013.01)] 62 Claims
OG exemplary drawing
 
1. A device comprising:
a first substrate;
a second substrate which overlaps the first substrate;
a first structure which is between the first substrate and the second substrate, the first structure including a first film of a dielectric material and a first portion of a conductive material, the first portion being in a groove of the first film; and
a second structure which is between the first structure and the second substrate, the second structure including a second film of a dielectric material and a second portion of a conductive material, the second portion being in a groove of the second film,
wherein a first face of the first film is bonded to a second face of the second film, and the first portion is bonded to the second portion, and
wherein the first portion includes a first conductive portion of a first conductive material, the first portion includes a first conductive film of a second conductive material other than the first conductive material,
the first film includes a diffusion preventing film configured to prevent a diffusion of a material from the first portion or the second portion, and
the first conductive film contacts the first film.