US 12,068,348 B2
Image sensor package with transparent cover partially covered by mold layer and manufacturing method thereof
Byoungrim Seo, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 26, 2021, as Appl. No. 17/240,092.
Claims priority of application No. 10-2020-0134953 (KR), filed on Oct. 19, 2020.
Prior Publication US 2022/0123038 A1, Apr. 21, 2022
Int. Cl. H01L 27/146 (2006.01); H04N 23/54 (2023.01); H04N 25/70 (2023.01)
CPC H01L 27/14625 (2013.01) [H01L 27/1462 (2013.01); H04N 23/54 (2023.01); H04N 25/70 (2023.01)] 18 Claims
OG exemplary drawing
 
1. An image sensor package comprising:
a substrate;
an image sensor on the substrate;
an adhesive film on the image sensor;
a transparent cover on the adhesive film, the transparent cover comprising a top surface, a first side surface and a second side surface disposed on the first side surface, the second side surface is inclined with respect to an extending direction of a bottom surface of the transparent cover; and
a mold layer covering an upper surface of the substrate, a side surface of the image sensor, a side surface of the adhesive film, the first side surface of the transparent cover and a partial portion of the second side surface of the transparent cover,
wherein a top surface of the mold layer is higher than a lower end of the second side surface and lower than the top surface of the transparent cover,
wherein a height of the second side surface is in a range of 100 μm to 250 μm.