US 12,068,347 B2
Solid-state imaging device and electronic device
Michiko Sakamoto, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/996,850
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Mar. 4, 2021, PCT No. PCT/JP2021/008486
§ 371(c)(1), (2) Date Oct. 21, 2022,
PCT Pub. No. WO2021/220610, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 2020-079022 (JP), filed on Apr. 28, 2020.
Prior Publication US 2023/0163149 A1, May 25, 2023
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14621 (2013.01) [H01L 27/14627 (2013.01); H01L 27/1464 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A solid-state imaging device comprising:
a plurality of microlenses that condenses incident light;
a plurality of color filters that transmits light of a specific wavelength included in the condensed incident light;
a plurality of photoelectric conversion parts on which light having a specific wavelength transmitted through at least one the color filters is incident; and
a plurality of waveguide wall parts arranged between the color filters and surrounding the color filters,
wherein each of the plurality of waveguide wall parts is formed in a position subjected to pupil correction.