US 12,068,344 B2
Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly
Mingzhu Wang, Zhejiang (CN); Takehiko Tanaka, Nara (JP); Nan Guo, Zhejiang (CN); Zhenyu Chen, Zhejiang (CN); and Bojie Zhao, Zhejiang (CN)
Assigned to NINGBO SUNNY OPOTECH CO., LTD., Zhejiang (CN)
Filed by Ningbo Sunny Opotech Co., Ltd., Zhejiang (CN)
Filed on Jul. 15, 2021, as Appl. No. 17/376,736.
Application 17/376,736 is a division of application No. 16/604,715, granted, now 11,094,727, previously published as PCT/CN2018/082819, filed on Apr. 12, 2018.
Claims priority of application No. 201710236249.6 (CN), filed on Apr. 12, 2017.
Prior Publication US 2021/0343768 A1, Nov. 4, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01); H01L 21/56 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 25/70 (2023.01)
CPC H01L 27/14618 (2013.01) [B29C 45/14467 (2013.01); B29C 45/14639 (2013.01); H01L 21/565 (2013.01); H01L 27/14685 (2013.01); H04N 23/55 (2023.01); H04N 25/70 (2023.01); B29L 2031/3481 (2013.01); H04N 23/54 (2023.01)] 17 Claims
OG exemplary drawing
 
1. A molding photosensitive assembly applied in at least one camera module, comprising:
a molding portion, wherein the molding portion comprises a molding portion main body, and the molding portion main body is made of transparent material;
a photosensitive chip;
a circuit board, wherein the photosensitive chip is attached to the circuit board in an electrical connection; and
a light transmitting element, wherein the light transmitting element is attached to a surface of the photosensitive chip;
wherein the molding portion main body of the molding portion, the photosensitive chip and the circuit board are formed into an integral structure by a molding process, and the molding portion main body embeds the light transmitting element on the photosensitive chip; and
wherein the molding portion further comprises a lens mounting section, and the lens mounting section is formed by extending upward from a periphery of the molding portion main body, and the lens mounting section and the molding portion main body are connected by integrally molding.