US 12,068,303 B2
Package structure
Wei-Hung Lin, Hsinchu County (TW); Hui-Min Huang, Taoyuan (TW); Chang-Jung Hsueh, Taipei (TW); Wan-Yu Chiang, Hsinchu (TW); Ming-Da Cheng, Taoyuan (TW); and Mirng-Ji Lii, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Oct. 5, 2023, as Appl. No. 18/481,975.
Application 18/481,975 is a division of application No. 17/460,347, filed on Aug. 30, 2021, granted, now 11,855,058.
Prior Publication US 2024/0038752 A1, Feb. 1, 2024
Int. Cl. H01L 25/18 (2023.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 21/78 (2013.01); H01L 23/3107 (2013.01); H01L 23/49838 (2013.01); H01L 24/96 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a plurality of dies;
an encapsulant encapsulating the plurality of dies;
a redistribution layer (RDL) structure disposed on active surfaces of the plurality of dies and the encapsulant to form a L-shaped package, wherein the L-shaped package has a cutting surface, and the cutting surface comprises:
a first surface extending along a X direction;
a second surface extending along a Y direction; and
a curved surface connecting the first and second surfaces; and
a plurality of conductive terminals disposed on the RDL structure.