US 12,068,283 B2
Die stack with cascade and vertical connections
Min-Tih Ted Lai, Folsom, CA (US); Florence R. Pon, Folsom, CA (US); Yuhong Cai, Folsom, CA (US); and John G. Meyers, Sacramento, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 15, 2021, as Appl. No. 17/502,287.
Application 17/502,287 is a continuation of application No. 15/780,506, granted, now 11,171,114, previously published as PCT/US2015/063346, filed on Dec. 2, 2015.
Prior Publication US 2022/0037291 A1, Feb. 3, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 24/96 (2013.01); H01L 25/50 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/46 (2013.01); H01L 2224/4801 (2013.01); H01L 2224/48011 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01)] 15 Claims
OG exemplary drawing
 
6. An electronic assembly comprising:
a plurality of shingles, individual of the plurality of shingles comprising a plurality of offset stacked electronic die coupled by cascade connections, the plurality of shingles arranged in a stack of shingles;
an overmold surrounding the plurality of shingles; and
a plurality of conductive connections only between a bottom electronic die of the individual of the plurality of shingles and an exposed top surface of the overmold, wherein a shingle offset between adjacent shingles decreases with successive shingles in the stack of shingles.