US 12,068,276 B2
Semiconductor device and corresponding method of manufacture
Giovanni Graziosi, Vimercate (IT); and Michele Derai, Milan (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (MB) (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Jun. 10, 2021, as Appl. No. 17/344,149.
Application 17/344,149 is a continuation in part of application No. 16/745,043, filed on Jan. 16, 2020, granted, now 11,764,134.
Prior Publication US 2021/0305203 A1, Sep. 30, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/64 (2006.01)
CPC H01L 24/82 (2013.01) [H01L 23/295 (2013.01); H01L 23/3135 (2013.01); H01L 23/49589 (2013.01); H01L 23/645 (2013.01); H01L 23/647 (2013.01); H01L 24/48 (2013.01); H01L 24/96 (2013.01); H01L 23/49513 (2013.01); H01L 23/49582 (2013.01); H01L 24/92 (2013.01); H01L 2224/24105 (2013.01); H01L 2224/24175 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48265 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/186 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method of making a device, comprising:
attaching a semiconductor chip to a chip mounting portion on at least one leadframe portion, and attaching a passive component on a passive component mounting portion of the at least one leadframe portion;
forming a laser direct structuring (LDS) activatable molding material over the semiconductor chip, the passive component, and the at least one leadframe portion;
forming desired patterns of structured areas within the LDS activatable molding material by activating the LDS activatable molding material;
metallizing the desired patterns of structured areas to form conductive areas within the LDS activatable molding material to thereby form electrical connection between the semiconductor chip and the passive component; and
forming a passivation layer on the LDS activatable molding material.