US 12,068,275 B2
Die bonding apparatus and manufacturing method for semiconductor device
Ryo Saegusa, Minami-Alps (JP); Masayuki Mochizuki, Minami-Alps (JP); and Keita Yamamoto, Minami-Alps (JP)
Assigned to Fasford Technology Co., Ltd., Minami-Alps (JP)
Filed by Fasford Technology Co., Ltd., Yamanashi (JP)
Filed on Aug. 11, 2021, as Appl. No. 17/399,272.
Claims priority of application No. 2020-136096 (JP), filed on Aug. 12, 2020; and application No. 2021-096125 (JP), filed on Jun. 8, 2021.
Prior Publication US 2022/0052017 A1, Feb. 17, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 21/687 (2006.01)
CPC H01L 24/75 (2013.01) [H01L 21/68764 (2013.01); H01L 2224/75702 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A die bonding apparatus comprising:
a driven body; and
a table for driving the driven body,
the table including:
a base;
a linear motor having a first mover that moves the driven body, and a stator;
a first linear motion guide that is provided between the base and the stator and capable of freely moving the stator;
a second linear motion guide that is provided between the base and the first mover and capable of freely moving the first mover;
a second mover provided in the form of being fixed to the base; and
a control device for controlling the first mover and the second mover,
wherein the control device is configured to suppress the vibration of the driven body during the time of the operation of the driven body by moving the first mover in a first direction along the second linear motion guide and, at the same time, by moving the stator in a second direction, which is a direction opposite to the first direction, along the first linear motion guide using the second mover.