US 12,068,258 B2
Method for fabricating electronic assembly including a magnetic field shielding film
Jiwoong Kong, Gyeonggi-do (KR); Jung Ju Suh, Seoul (KR); and Seong-Woo Woo, Gyeonggi-do (KR)
Assigned to 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Filed on May 5, 2022, as Appl. No. 17/737,285.
Application 17/737,285 is a continuation of application No. 17/249,559, filed on Mar. 5, 2021, granted, now 11,355,453.
Application 17/249,559 is a continuation of application No. 16/822,145, filed on Mar. 18, 2020, granted, now 10,985,111, issued on Apr. 20, 2021.
Claims priority of application No. 10-2019-0033151 (KR), filed on Mar. 22, 2019.
Prior Publication US 2022/0262740 A1, Aug. 18, 2022
Int. Cl. H01L 23/552 (2006.01); H01L 21/50 (2006.01); H05K 9/00 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/50 (2013.01); H05K 9/0026 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for fabricating an electronic assembly, the method comprising:
providing a board comprising a plurality of traces having an electrical conductivity, and at least two spatially spaced semiconductor integrated circuits which are mounted on a first main surface of the board and are electrically connected with the plurality of traces;
disposing a protection layer on the at least two spatially spaced integrated circuits;
forming a multilayer article by disposing a magnetic field shielding film on a main top surface of the protection layer, the magnetic field shielding film being a multilayer film comprising a magnetic field shielding layer disposed between first and second adhesive layers, each of the first and second adhesive layers being configured to bond the magnetic field shielding layer to a layer adjacent to the magnetic field shielding layer;
producing at least two cut multilayer articles by cutting the multilayer article along a thickness direction of the multilayer article at a predetermined cutting point between the at least two spatially spaced integrated circuits, each of the cut multilayer articles comprising a cut multilayer edge surface comprising exposed edges of the board, the protection layer, and the magnetic field shielding film at the predetermined cutting point; and
with respect to at least one of the cut multilayer articles, fabricating the electronic assembly by disposing a first metal layer at least on a main top surface and the cut multilayer edge surface of the at least one cut multilayer article.