CPC H01L 23/49838 (2013.01) [H01L 23/4985 (2013.01); H01L 23/49866 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 25/50 (2013.01)] | 20 Claims |
1. A package, comprising:
one or more die; and
an interposer coupled to the die, wherein the interposer comprises circuit traces, wherein the circuit traces are provided in a serpentine configuration, wherein the serpentine configuration provides a spring-like characteristic allowing the circuit traces to deform under stress and return to original state undamaged better than a non-serpentine circuit trace.
|