US 12,068,232 B2
Integrated circuit package with serpentine conductor and method of making
Michael Wang, Irvine, CA (US); Cheng Lee, Irvine, CA (US); Joon Yeob Lee, Irvine, CA (US); Reza Sharifi, Irvine, CA (US); Liming Tsau, Irvine, CA (US); and Junfei Zhu, Irvine, CA (US)
Assigned to Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed by Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed on Oct. 29, 2021, as Appl. No. 17/514,722.
Prior Publication US 2023/0138918 A1, May 4, 2023
Int. Cl. H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/49838 (2013.01) [H01L 23/4985 (2013.01); H01L 23/49866 (2013.01); H01L 23/5386 (2013.01); H01L 23/5387 (2013.01); H01L 25/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package, comprising:
one or more die; and
an interposer coupled to the die, wherein the interposer comprises circuit traces, wherein the circuit traces are provided in a serpentine configuration, wherein the serpentine configuration provides a spring-like characteristic allowing the circuit traces to deform under stress and return to original state undamaged better than a non-serpentine circuit trace.