US 12,068,225 B2
System for cooling components in an electronic module
Nelson Rene Garcia-Polanco, Besozzo (IT); John Piero Piero Doyle, Brunello (IT); Raffaele Paganini, Comerio (IT); and Francesco Mastrangelo, Saluzzo (IT)
Assigned to Whirlpool Corporation, Benton Harbor, MI (US)
Filed by WHIRLPOOL CORPORATION, Benton Harbor, MI (US)
Filed on Aug. 2, 2022, as Appl. No. 17/878,949.
Application 17/878,949 is a division of application No. 16/309,214, granted, now 11,417,585, previously published as PCT/US2017/063884, filed on Nov. 30, 2017.
Claims priority of provisional application 62/428,012, filed on Nov. 30, 2016.
Prior Publication US 2022/0375823 A1, Nov. 24, 2022
Int. Cl. H01L 23/467 (2006.01); F28F 13/02 (2006.01); F28F 13/12 (2006.01); F28D 21/00 (2006.01)
CPC H01L 23/467 (2013.01) [F28F 13/02 (2013.01); F28F 13/12 (2013.01); F28D 2021/0029 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a thermal reservoir;
a rotating heat transfer structure having an axially symmetrical body made of a conductive material with fins for transferring fluid from in an inlet port to an outlet port;
a motor for rotating the rotating heat transfer structure relative to the thermal reservoir; and
a Belleville spring assembly bearing the inertial forces acting on the rotating heat transfer structure while allowing precise setting of the distance of the rotating heat transfer structure with respect to the thermal reservoir such that there is no contact between the rotating heat transfer structure and the thermal reservoir, the Belleville spring assembly comprising multiple sets of Belleville springs assembled on both sides of the rotating heat transfer structure to set the displacement by leverage nut displacement.