US 12,068,215 B2
Method and apparatus for providing thermal wear leveling
David A. Roberts, Boxborough, MA (US); Greg Sadowski, Boxborough, MA (US); and Steven Raasch, Boxborough, MA (US)
Assigned to ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed by ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US)
Filed on Jan. 9, 2023, as Appl. No. 18/152,022.
Application 18/152,022 is a continuation of application No. 15/674,607, filed on Aug. 11, 2017, granted, now 11,551,990.
Prior Publication US 2023/0143622 A1, May 11, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/34 (2006.01); G05B 15/02 (2006.01); G06F 1/20 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/34 (2013.01) [G05B 15/02 (2013.01); G06F 1/20 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06589 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A method for providing thermal wear spreading among a plurality of thermal die regions the method comprising:
producing die region wear-out data for a die region in each die of a plurality of stacked dies, the die region wear-out data representing a cumulative amount of time each of the plurality of thermal die regions has spent at a temperature level, based on temperature data from each of the plurality of thermal die regions;
storing, in persistent memory, the die region wear-out data; and
spreading thermal wear among the plurality of thermal die regions using a spreading operation based on operating condition data that is not accumulated over a life of a respective thermal region, that overrides a thermal wear spreading operation that is based on the die region wear-out data from the persistent memory, that is accumulated over the life of the respective thermal region.