US 12,068,212 B2
Package structure with through via extending through redistribution layer and method of manufacturing the same
Chih-Hsuan Tai, Taipei (TW); Chih-Hua Chen, Hsinchu County (TW); Hao-Yi Tsai, Hsinchu (TW); Yu-Chih Huang, Hsinchu (TW); Chia-Hung Liu, Hsinchu (TW); and Ting-Ting Kuo, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 11, 2022, as Appl. No. 17/718,309.
Application 17/718,309 is a continuation of application No. 16/714,801, filed on Dec. 16, 2019, granted, now 11,309,225.
Application 16/714,801 is a continuation of application No. 15/706,783, filed on Sep. 18, 2017, granted, now 10,510,631, issued on Dec. 17, 2019.
Prior Publication US 2022/0238406 A1, Jul. 28, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/10 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3114 (2013.01) [H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 22/32 (2013.01); H01L 23/3128 (2013.01); H01L 23/5226 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82005 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/92244 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06596 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a die;
an encapsulant laterally encapsulating the die;
a first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer;
a second RDL structure on a second side of the die and the encapsulant;
a conductive terminal connected to the redistribution layer; and
a through via extending through the encapsulant and the redistribution layer to contact the conductive terminal and the second RDL structure,
wherein the through via contacts a bottom surface of the redistribution layer.