US 12,068,211 B2
Electronic package comprising multiple wires inside an electronic component
Ho-Chuan Lin, Taichung (TW); Min-Han Chuang, Taichung (TW); and Chia-Chu Lai, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jun. 27, 2023, as Appl. No. 18/215,107.
Application 18/215,107 is a division of application No. 17/368,475, filed on Jul. 6, 2021, granted, now 11,728,234.
Claims priority of application No. 110116024 (TW), filed on May 4, 2021.
Prior Publication US 2023/0343664 A1, Oct. 26, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/528 (2006.01)
CPC H01L 23/3107 (2013.01) [H01L 21/56 (2013.01); H01L 23/5286 (2013.01); H01L 24/11 (2013.01); H01L 24/14 (2013.01); H01L 24/43 (2013.01); H01L 24/45 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
an encapsulant;
a first electronic component embedded in the encapsulant, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface, and a plurality of wires separated and disconnected from one another and electrically connected with the at least one electrode pad are provided inside the first electronic component; and
a plurality of conductive layers separated and disconnected from one another, formed on the first electronic component and embedded in the encapsulant, wherein each of the plurality of wires is electrically connected to a different conductive layer, wherein the plurality of conductive layers are free from being formed on the at least one electrode pad.