US 12,068,209 B2
Power module
Stephan Jonas, Neunburg (DE); Norbert Reichenbach, Amberg (DE); and Juergen Trottmann, Falkenberg (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Filed by Siemens Aktiengesellschaft, Munich (DE)
Filed on Mar. 30, 2022, as Appl. No. 17/708,209.
Claims priority of application No. 21165837 (EP), filed on Mar. 30, 2021.
Prior Publication US 2022/0319939 A1, Oct. 6, 2022
Int. Cl. H01L 23/053 (2006.01); G01K 1/08 (2021.01); H01L 23/34 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/053 (2013.01) [G01K 1/08 (2013.01); H01L 23/34 (2013.01); H01L 25/072 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A power module, comprising:
a housing including an interior, a carrier plate, housing walls and a housing cover;
semiconductor elements disposed on said carrier plate in said interior of said housing;
a temperature sensor unit having a temperature sensor disposed on said carrier plate in said interior of said housing; and
partitions disposed in said interior of said housing, said partitions separating said temperature sensor unit from said semiconductor elements and enclosing said temperature sensor unit in a chamber, and said partitions including a lower edge facing said carrier plate and having a reduced wall thickness.