US 12,068,176 B2
Apparatus and method of manufacturing solder bump
Sungyong Yun, Hwaseong-si (KR); Sanghoon Lee, Seongnam-si (KR); and Sungil Lee, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 7, 2022, as Appl. No. 18/063,029.
Application 18/063,029 is a continuation of application No. 17/012,624, filed on Sep. 4, 2020, granted, now 11,551,944.
Claims priority of application No. 10-2019-0110771 (KR), filed on Sep. 6, 2019.
Prior Publication US 2023/0104577 A1, Apr. 6, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/67098 (2013.01) [H01L 24/11 (2013.01); H01L 24/13 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of manufacturing a solder bump, the method comprising:
providing a substrate, comprising a solder bump which is not reflowed, to a supporter in a reflow space defined by a housing and a cover;
applying energy to an edge heating zone provided along a perimeter of the cover;
supplying an oxide remover to the substrate; and
heating a supporter heating part provided in the supporter, for reflowing the solder bump,
wherein the cover comprises a first portion substantially parallel to a main surface of the substrate and a second portion substantially vertical to the main surface of the substrate, and
the edge heating zone is provided in the first portion of the cover.