US 12,068,174 B2
Arrangement of a power semiconductor module and a cooler
Daniele Torresin, Baden (CH); Fabian Mohn, Ennetbaden (CH); Bruno Agostini, Zurich (CH); Thomas Gradinger, Aarau Rohr (CH); and Juergen Schuderer, Zurich (CH)
Assigned to Hitachi Energy Ltd, Zurich (CH)
Appl. No. 17/630,080
Filed by Hitachi Energy Ltd, Zurich (CH)
PCT Filed Jul. 24, 2020, PCT No. PCT/EP2020/071001
§ 371(c)(1), (2) Date Jan. 25, 2022,
PCT Pub. No. WO2021/014002, PCT Pub. Date Jan. 28, 2021.
Claims priority of application No. 19188381 (EP), filed on Jul. 25, 2019.
Prior Publication US 2022/0254653 A1, Aug. 11, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/367 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01)
CPC H01L 21/4882 (2013.01) [H01L 21/4842 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01); H01L 23/473 (2013.01); H01L 2924/0002 (2013.01); H05K 7/20927 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method comprising:
providing a power semiconductor module that comprises a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side, wherein the second substrate side has a flat surface, and wherein located at the second substrate side is a cooling area that is surrounded by a connecting area;
connecting a first casing component of a cooler to the second substrate side at the connecting area,
connecting a second casing component to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component; and
welding a cooling structure to the cooling area at the second substrate side, the cooling structure having a wavy form.