US 12,068,173 B2
Package structure and manufacturing method thereof
Li-Hui Cheng, New Taipei (TW); Szu-Wei Lu, Hsinchu (TW); Ping-Yin Hsieh, Hsinchu (TW); and Chih-Hao Chen, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on May 22, 2023, as Appl. No. 18/321,686.
Application 17/389,193 is a division of application No. 16/283,851, filed on Feb. 25, 2019, granted, now 11,081,369, issued on Aug. 3, 2021.
Application 18/321,686 is a continuation of application No. 17/389,193, filed on Jul. 29, 2021, granted, now 11,699,597.
Prior Publication US 2023/0290650 A1, Sep. 14, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01)
CPC H01L 21/486 (2013.01) [H01L 21/561 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 2224/24175 (2013.01); H01L 2224/25171 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A manufacturing method of package structure, comprising:
forming polymer ring patterns;
providing conductive through vias on the respective polymer ring patterns and providing semiconductor dies in an area enclosed by the polymer ring patterns;
laterally encapsulating the semiconductor dies, the conductive through vias and the polymer ring patterns with an insulating encapsulant;
forming a redistribution structure over the insulating encapsulant, the conductive through vias and the semiconductor dies, wherein the redistribution structure is electrically connected to the conductive through vias and the semiconductor dies;
disposing conductive terminals on the redistribution structure; and
removing the polymer ring patterns to expose the conductive through vias.