US 12,068,152 B2
Semiconductor substrate bevel cleaning
Saravanapriyan Sriraman, Fremont, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Appl. No. 17/767,228
Filed by LAM RESEARCH CORPORATION, Fremont, CA (US)
PCT Filed Oct. 8, 2020, PCT No. PCT/US2020/054663
§ 371(c)(1), (2) Date Apr. 7, 2022,
PCT Pub. No. WO2021/071999, PCT Pub. Date Apr. 15, 2021.
Claims priority of provisional application 62/913,427, filed on Oct. 10, 2019.
Prior Publication US 2022/0375746 A1, Nov. 24, 2022
Int. Cl. H01L 21/02 (2006.01); H01J 37/32 (2006.01)
CPC H01L 21/02087 (2013.01) [H01J 37/32385 (2013.01); H01J 37/3244 (2013.01); H01J 37/32532 (2013.01); H01L 21/02057 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A system for performing a bevel cleaning process on a substrate, the system comprising:
a substrate support including an electrode, wherein at least a portion of the electrode is embedded within a dielectric; and
a plurality of plasma needles arranged around a perimeter of the substrate support, wherein the plasma needles are in fluid communication with a gas delivery system and are configured to (i) supply reactive gases from the gas delivery system to a bevel region of the substrate when the substrate is arranged on the substrate support and (ii) electrically couple to the electrode of the substrate support and generate plasma around the bevel region of the substrate.