US 12,068,141 B2
Ring assembly, substrate support apparatus and plasma processing apparatus including the same
Sungki Lee, Hwaseong-si (KR); Jonggun Yoon, Seoul (KR); and Sungkyu Choi, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 19, 2022, as Appl. No. 17/969,379.
Claims priority of application No. 10-2021-0183842 (KR), filed on Dec. 21, 2021.
Prior Publication US 2023/0197419 A1, Jun. 22, 2023
Int. Cl. H01J 37/32 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01)
CPC H01J 37/32642 (2013.01) [H01L 21/68742 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate support apparatus, comprising:
a substrate stage configured to have a wafer seated thereon; and
a ring assembly configured to control plasma in an edge region of the wafer,
wherein the ring assembly comprising:
an outer insulating ring around an upper outer periphery of the substrate stage;
an edge ring around the substrate stage, and on the outer insulating ring; and
a shadow ring configured to move up and down within a predetermined stroke range above the outer insulating ring and the edge ring, the shadow ring configured to cover the edge region of the wafer while the wafer is seated on the substrate stage,
wherein an upper surface of the edge ring is located higher than an upper surface of the substrate stage by a predetermined height, and
wherein the shadow ring comprises:
a body portion comprising an annular shape; and
a recess in a bottom surface of the body portion, the recess configured to accommodate at least a portion of a protruding upper portion of the edge ring.