US 12,068,094 B2
Resistor unit, manufacturing method therefor, and device provided with resistor unit
Shingo Fujihara, Tokyo (JP); and Yuji Jumonji, Tokyo (JP)
Assigned to SEMITEC Corporation, Tokyo (JP)
Appl. No. 17/636,361
Filed by SEMITEC Corporation, Tokyo (JP)
PCT Filed Aug. 21, 2020, PCT No. PCT/JP2020/031622
§ 371(c)(1), (2) Date Feb. 18, 2022,
PCT Pub. No. WO2021/044876, PCT Pub. Date Mar. 11, 2021.
Claims priority of application No. 2019-161270 (JP), filed on Sep. 4, 2019.
Prior Publication US 2022/0301750 A1, Sep. 22, 2022
Int. Cl. H01C 17/242 (2006.01); H01C 1/142 (2006.01); H01C 1/144 (2006.01); H01C 7/00 (2006.01)
CPC H01C 17/242 (2013.01) [H01C 1/142 (2013.01); H01C 1/144 (2013.01); H01C 7/008 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A resistor unit comprising:
a resistor; and
at least one pair of electrode layers formed on one surface and another surface opposite to the one surface of the resistor, wherein
in at least one of the at least one pair of electrode layers, a removal part for trimming is formed in a region in a formation region of the electrode layer, the region excluding a peripheral edge,
wherein a lead wire is connected to the at least one pair of electrode layers by soldering, and the lead wire straddles the removal part for trimming.