US 12,067,340 B2
Computational wafer inspection
Christophe David Fouquet, Retie (BE); Bernardo Kastrup, Veldhoven (NL); Arie Jeffrey Den Boef, Waalre (NL); Johannes Catharinus Hubertus Mulkens, Valkenswaard (NL); James Benedict Kavanagh, Veldhoven (NL); James Patrick Koonmen, Santa Clara, CA (US); and Neal Patrick Callan, Lake Oswego, OR (US)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
Filed on Jul. 30, 2021, as Appl. No. 17/389,682.
Application 17/389,682 is a continuation of application No. 16/804,048, filed on Feb. 28, 2020, granted, now 11,080,459.
Application 16/804,048 is a continuation of application No. 15/996,992, filed on Jun. 4, 2018, granted, now 10,579,772.
Application 15/996,992 is a continuation of application No. 15/339,669, filed on Oct. 31, 2016, granted, now 9,990,462.
Application 15/339,669 is a continuation of application No. 14/730,993, filed on Jun. 4, 2015, granted, now 9,507,907.
Claims priority of provisional application 62/023,589, filed on Jul. 11, 2014.
Claims priority of provisional application 62/010,221, filed on Jun. 10, 2014.
Prior Publication US 2021/0357570 A1, Nov. 18, 2021
Int. Cl. G06F 7/00 (2006.01); G03F 7/00 (2006.01); G06F 30/20 (2020.01); G06F 30/398 (2020.01); G06N 7/01 (2023.01); H01L 21/66 (2006.01)
CPC G06F 30/398 (2020.01) [G03F 7/705 (2013.01); G03F 7/70525 (2013.01); G03F 7/7065 (2013.01); G06F 30/20 (2020.01); G06N 7/01 (2023.01); H01L 22/20 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A non-transitory computer readable medium having instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to at least:
obtain an actual value of a parameter associated with a pattern processed by a semiconductor device manufacturing process onto a substrate; and
determine or predict, by a computer hardware system processing a machine learning model that takes the actual value, or information derived therefrom, as an input, an existence, a probability of existence, a characteristic, or a combination selected therefrom, of a defect produced from the pattern using the device manufacturing process.