US 12,066,514 B2
Integrated thin-film resistive sensor with integrated heater and metal layer thermal equalizer
Vamsikrishna Parupalli, Austin, TX (US); and Zhong You, Austin, TX (US)
Assigned to CIRRUS LOGIC, INC., Austin, TX (US)
Filed by CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD., Edinburgh (GB)
Filed on Aug. 9, 2022, as Appl. No. 17/884,521.
Prior Publication US 2024/0053425 A1, Feb. 15, 2024
Int. Cl. G01R 35/00 (2006.01); G01R 27/16 (2006.01)
CPC G01R 35/005 (2013.01) [G01R 27/16 (2013.01)] 28 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a substrate;
a first metal layer formed above a top side of the substrate in a region of the substrate;
a first insulating layer formed on a top side of the first metal layer in the region of the substrate;
a resistive layer formed on a top side of the first insulating layer and lying at least partially within the region of the substrate;
a second insulating layer formed above a top side of the resistive layer in the region of the substrate;
a second metal layer formed on the top side of the second insulating layer in the region of the substrate; and
a plurality of thermally conductive vias bonded to the first metal layer and the second metal layer to provide thermal flow to at least partially equalize a temperature of the first metal layer and the second metal layer, and wherein the first metal layer and the second metal layer at least partially equalize a temperature along a length and a width of the resistive layer.