US 12,066,334 B2
Sensor configured to sense heat or infrared light and electronic device including same
Yeong Suk Choi, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 28, 2022, as Appl. No. 17/851,724.
Claims priority of application No. 10-2021-0085174 (KR), filed on Jun. 29, 2021.
Prior Publication US 2023/0026770 A1, Jan. 26, 2023
Int. Cl. G01J 5/20 (2006.01); G01J 5/02 (2022.01)
CPC G01J 5/20 (2013.01) [G01J 5/0215 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A sensor configured to sense heat or infrared light, the sensor comprising
a substrate including a recess portion having a bottom portion and opposite side portions connected to opposite ends of the bottom portion, the recess portion having outer surfaces at least partially defining a recess into the substrate, the substrate including one or more inner surfaces at least partially defining a cavity inside the substrate along the bottom portion and the opposite side portions of the recess portion;
a lower reflective layer on at least one of an upper surface of the bottom portion of the substrate, a lower surface of the bottom portion of the recess portion of the substrate, or a surface opposite to the lower surface of the bottom portion of the recess portion of the substrate;
a first electrode and a second electrode inside opposing inner side surfaces of the recess portion and facing each other;
a pixel structure configured to sense heat or infrared light inside the recess portion and embedded in the substrate; and
a planarization layer covering an entire upper portion of the substrate.