US 12,066,173 B2
Light emitting device having improved illumination and manufacturing flexibility
Alan Feit, Los Angeles, CA (US); and Gerardo Cisneros, Buena Park, CA (US)
Assigned to FEIT ELECTRIC COMPANY, INC., Pico Rivera, CA (US)
Filed by FEIT ELECTRIC COMPANY, INC., Pico Rivera, CA (US)
Filed on Sep. 20, 2023, as Appl. No. 18/470,914.
Application 18/470,914 is a continuation of application No. 17/988,623, filed on Nov. 16, 2022, granted, now 11,796,163.
Application 17/988,623 is a continuation of application No. 15/930,306, filed on May 12, 2020, granted, now 11,592,166, issued on Feb. 28, 2023.
Prior Publication US 2024/0011627 A1, Jan. 11, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. F21V 23/00 (2015.01); F21V 23/06 (2006.01); F21V 29/70 (2015.01); F21Y 115/10 (2016.01)
CPC F21V 23/005 (2013.01) [F21V 23/001 (2013.01); F21V 23/06 (2013.01); F21V 29/70 (2015.01); F21Y 2115/10 (2016.08)] 20 Claims
OG exemplary drawing
 
1. A substrate assembly comprising:
a first substrate having a first outward facing surface;
a second substrate adjacent the first substrate and having driver circuitry attached to a second outward facing surface thereof, the second substrate having at least one of a size or a shape identical to that of the first substrate, and
a wire connection electrically coupling the first substrate and the second substrate wherein:
one or more arrays of light emitting diodes are confined to the first outward facing surface, such that the second substrate is free of light emitting diodes; and
the driver circuitry drives the one or more arrays of light emitting diodes via the wire connection.