US 12,066,031 B2
Fan module
Hsin-Chen Lin, Taipei (TW); and Ing-Jer Chiou, Taipei (TW)
Assigned to ASUSTEK COMPUTER INC., Taipei (TW)
Filed by ASUSTeK COMPUTER INC., Taipei (TW)
Filed on Apr. 9, 2023, as Appl. No. 18/297,632.
Claims priority of application No. 111136338 (TW), filed on Sep. 26, 2022.
Prior Publication US 2024/0102483 A1, Mar. 28, 2024
Int. Cl. F04D 25/08 (2006.01); F04D 29/18 (2006.01)
CPC F04D 29/181 (2013.01) [F04D 25/08 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A fan module, comprising:
a hub configured to rotate about a central axis;
a plurality of fan blades surrounding the hub, wherein each of the plurality of fan blades comprises a first end portion connected to the hub and a second end portion opposite to the first end portion; and
a ring frame connected to the second end portion of each of the plurality of fan blades, wherein the ring frame comprises a first surface facing the plurality of blades and a second surface opposite to the first surface, the first surface is a curved surface, and the second surface is a plane surface or an inclined surface and is coplanar with at least one of a lower surface and an upper surface of each of the plurality of fan blades,
wherein the ring frame further comprises an inner edge close to the first end portion and an outer edge close to the second end portion, and a thickness of the inner edge and a thickness of the outer edge are both smaller than a maximum thickness of the ring frame.