	US 12,065,597 B2
	Adhesive tape
Daisuke Watanabe, Kitaadachi-gun (JP)
Assigned to DIC CORPORATION, Tokyo (JP)
Appl. No. 17/629,891
Filed by DIC Corporation, Tokyo (JP)
PCT Filed Aug. 27, 2020, PCT No. PCT/JP2020/032266 § 371(c)(1), (2) Date Jan. 25, 2022, PCT Pub. No. WO2021/039877, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-159016 (JP), filed on Aug. 30, 2019.
Prior Publication US 2022/0251423 A1, Aug. 11, 2022
Int. Cl. C09J 7/24 (2018.01); C08K 3/22 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C09J 133/08 (2006.01)

CPC C09J 7/243 (2018.01) [C08K 3/22 (2013.01); C09J 7/245 (2018.01); C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09J 133/08 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/003 (2013.01); C09J 2301/124 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/502 (2020.08); C09J 2409/001 (2013.01); C09J 2423/041 (2013.01); C09J 2423/101 (2013.01); C09J 2425/001 (2013.01); C09J 2433/00 (2013.01); C09J 2453/001 (2013.01); C09J 2483/00 (2013.01)]

13 Claims

1. An adhesive tape comprising:

a base material layer; and

adhesive layers formed of an adhesive composition provided on both sides of the base material layer,

wherein the base material layer has a thickness of 10 to 100 μm, a breaking strength of 30 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and

the adhesive composition comprises:

an adhesive resin; and

1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 μm with respect to 100% by mass of the adhesive composition.