US 12,065,561 B2
Resin composition, molded article, electronic component, and electronic device
Mitsuyo Matsumoto, Kanagawa (JP); Yoshitaka Sekiguchi, Kanagawa (JP); and Natsuki Koike, Kanagawa (JP)
Assigned to Ricoh Company, Ltd., Tokyo (JP)
Filed by RICOH COMPANY, LTD., Tokyo (JP)
Filed on Jun. 3, 2021, as Appl. No. 17/338,052.
Claims priority of application No. 2020-107899 (JP), filed on Jun. 23, 2020.
Prior Publication US 2021/0395496 A1, Dec. 23, 2021
Int. Cl. C08L 5/00 (2006.01); C08K 3/32 (2006.01); C08K 5/523 (2006.01); C08K 5/5313 (2006.01); C08K 5/5399 (2006.01); C08L 23/12 (2006.01)
CPC C08L 5/00 (2013.01) [C08K 3/32 (2013.01); C08K 5/5313 (2013.01); C08K 5/5399 (2013.01); C08L 23/12 (2013.01); C08K 2003/323 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01)] 9 Claims
 
1. A resin composition comprising:
a resin including:
a β-1,3-glucan derivative resin having a main chain having a structure represented by the following structural formula (1):

OG Complex Work Unit Chemistry
where each of Rs is independently a hydrogen atom or an alkylcarbonyl group, at least one of Rs is an alkylcarbonyl group, and n is a natural number, and the alkylcarbonyl group is at least one group selected from the group consisting of acetyl group, propionyl group, isopropionyl group, butyryl group, isobutyryl group, pentanoyl group, hexanoyl group, and heptanoyl group; and
a phosphorus-based flame retardant,
wherein the phosphorus-based flame retardant has an average particle diameter of 5 pm or less in the resin.