US 12,065,385 B2
Ceramic-copper composite, method of producing ceramic-copper composite, ceramic circuit board, and power module
Akimasa Yuasa, Omuta (JP); Takahiro Nakamura, Omuta (JP); Shuhei Morita, Omuta (JP); and Koji Nishimura, Omuta (JP)
Assigned to DENKA COMPANY LIMITED, Tokyo (JP)
Appl. No. 17/296,172
Filed by DENKA COMPANY LIMITED, Tokyo (JP)
PCT Filed Nov. 22, 2019, PCT No. PCT/JP2019/045833
§ 371(c)(1), (2) Date May 21, 2021,
PCT Pub. No. WO2020/105734, PCT Pub. Date May 28, 2020.
Claims priority of application No. 2018-218964 (JP), filed on Nov. 22, 2018.
Prior Publication US 2022/0009842 A1, Jan. 13, 2022
Int. Cl. B32B 7/12 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01)
CPC C04B 37/026 (2013.01) [B32B 7/12 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); B32B 2250/40 (2013.01); B32B 2457/08 (2013.01); C04B 2237/125 (2013.01); C04B 2237/407 (2013.01); C04B 2237/60 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A ceramic-copper composite having a flat plate shape, comprising:
a ceramic layer;
a copper layer; and
a brazing material layer present between the ceramic layer and the copper layer,
wherein when a region having a length of 1,700 μm in a long-side direction is a region P on a cut surface of the ceramic-copper composite obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, and a region within 50 μm on a side of the copper layer from an interface between the ceramic layer and the brazing material layer in the region P is a region P1, an average crystal grain size D1 of copper crystals of the region P1, calculated based on (1) the crystal grain size of copper crystals that are located entirely within the region P1 together with (2) the crystal grain size of copper crystals located partially within the region P1 and partially outside of the region P1, is 30 μm or more and 100 μm or less.