US 12,065,073 B2
LED lamp for a vehicle and a method of manufacturing the same using mid and magnetic induction technologies
Jun Sik Kim, Gwacheon-si (KR); Jung Sik Choi, Siheung-si (KR); Young Do Kim, Ansan-si (KR); Tae Kyoung Jung, Bucheon-si (KR); Seung-Sik Han, Hwaseong-si (KR); Hong-Sik Chang, Hwaseong-si (KR); Kwang-Pyo Cho, Gwangmyeong-si (KR); Young-Ju Lee, Suwon-si (KR); Jong-Hyun Park, Uiwang-si (KR); Jin-Won Lee, Suwon-si (KR); Jun-Geun Oh, Hwaseong-si (KR); Cheon-Ho Kim, Hwaseong-si (KR); Young-Jai Im, Hwaseong-si (KR); Sun-Mi Oh, Bucheon-si (KR); Kang-Sun Lee, Seongnam-si (KR); Sae-Ah Kim, Hwaseong-si (KR); Jong-Eun Park, Yongin-si (KR); Kwan-Woo Lee, Yongin-si (KR); Jong-Chae Lee, Anyang-si (KR); Jun-Hyun Park, Anyang-si (KR); Won-Il Lee, Gwangju (KR); and Dae-Woo Park, Gwangju (KR)
Assigned to HYUNDAI MOTOR COMPANY, Seoul (KR); KIA CORPORATION, Seoul (KR); BS TECHNICS CO., LTD., Ansan-si (KR); NIFCO KOREA INC., Asan-si (KR); HYUNDAI MOBIS CO., LTD., Seoul (KR); and ALPS ELECTRIC KOREA CO., LTD., Gwangju (KR)
Filed by HYUNDAI MOTOR COMPANY, Seoul (KR); KIA CORPORATION, Seoul (KR); BS TECHNICS CO., LTD., Ansan-si (KR); NIFCO KOREA INC., Anyang-si (KR); HYUNDAI MOBIS CO., LTD., Seoul (KR); and ALPS ELECTRIC KOREA CO., LTD., Gwangju (KR)
Filed on Apr. 27, 2023, as Appl. No. 18/140,447.
Claims priority of application No. 10-2022-0056078 (KR), filed on May 6, 2022.
Prior Publication US 2023/0356652 A1, Nov. 9, 2023
Int. Cl. H02J 50/10 (2016.01); B60Q 1/26 (2006.01); F21V 19/00 (2006.01); F21V 29/70 (2015.01); F21Y 115/10 (2016.01)
CPC B60Q 1/2696 (2013.01) [F21V 19/002 (2013.01); F21V 29/70 (2015.01); H02J 50/10 (2016.02); F21Y 2115/10 (2016.08)] 13 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) lamp for a vehicle using molded interconnect device (MID) and magnetic induction technologies, the LED lamp comprising:
a LED module;
a housing accommodating the LED module;
a socket connecting unit connected to a lower portion of the housing and connected to a lamp socket provided in the vehicle;
a MID electrode including a LED electrode formed on a surface of the housing and a socket electrode formed on a surface of the socket connecting unit; and
a MID heat-dissipation layer formed on the surface of the housing on which the LED module is seated,
wherein the LED module is mounted on the MID electrode,
wherein the MID heat-dissipation layer is connected to the LED electrode and is configured to dissipate heat generated from the LED module through the LED electrode to an outside of the LED lamp,
wherein the LED electrode includes a pair of first and second LED electrodes connected to both sides of the LED module, and
wherein the MID electrode includes a wiring structure in which the first LED electrode has a gear unit wiring wired in a shape of a gear unit and the second LED electrode has a hinge hole wiring extending to a hinge hole.