US 12,064,965 B2
Element substrate and print head
Yosuke Miura, Tokyo (JP); Yasuo Fujii, Kanagawa (JP); and Yasuhiro Soeda, Kanagawa (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Sep. 1, 2022, as Appl. No. 17/901,033.
Claims priority of application No. 2021-143903 (JP), filed on Sep. 3, 2021.
Prior Publication US 2023/0074434 A1, Mar. 9, 2023
Int. Cl. B41J 2/14 (2006.01)
CPC B41J 2/14072 (2013.01) 11 Claims
OG exemplary drawing
 
1. An element substrate comprising:
a plurality of arranged heating elements; and
an electrical wiring line configured to supply the heating elements with power,
the electrical wiring line being provided in a first electrical wiring layer and a second electrical wiring layer overlapping the first electrical wiring layer,
wherein the first electrical wiring layer includes a first wiring line connected to one connecting unit of the heating elements and a second wiring line connected to the other connecting unit of the heating elements,
wherein the second electrical wiring layer includes a third wiring line connected to the first wiring line and a fourth wiring line connected to the second wiring line,
the first electrical wiring layer including a first wiring group in which at least one pair of the first wiring line and the second wiring line are provided in parallel,
the second electrical wiring layer including a second wiring group in which at least one pair of the third wiring line and the fourth wiring line are provided in parallel,
wherein a wiring line of the first wiring group and a wiring line of the second wiring group intersect when viewed from a viewpoint of a line orthogonal to the first electrical wiring layer, and
wherein the first wiring group and the second wiring group are different in wiring thickness.