US 12,064,795 B2
Conditioning chamber component
Amir A. Yasseri, San Jose, CA (US); Hong Shih, Santa Clara, CA (US); John Daugherty, Fremont, CA (US); Duane Outka, Fremont, CA (US); Lin Xu, Fremont, CA (US); Armen Avoyan, Glendale, CA (US); Cliff La Croix, Gardnerville, NV (US); and Girish Hundi, Dublin, CA (US)
Assigned to Lam Research Corporation, Fremont, CA (US)
Filed by Lam Research Corporation, Fremont, CA (US)
Filed on Mar. 24, 2021, as Appl. No. 17/211,518.
Application 17/211,518 is a division of application No. 15/969,626, filed on May 2, 2018, granted, now 10,967,407.
Claims priority of provisional application 62/500,688, filed on May 3, 2017.
Prior Publication US 2021/0205858 A1, Jul. 8, 2021
Int. Cl. B08B 7/04 (2006.01); B08B 3/04 (2006.01); B08B 3/12 (2006.01); B08B 3/14 (2006.01); B08B 5/02 (2006.01); H01J 37/32 (2006.01)
CPC B08B 7/04 (2013.01) [B08B 3/048 (2013.01); B08B 3/12 (2013.01); B08B 3/14 (2013.01); B08B 5/02 (2013.01); H01J 37/32853 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A method for conditioning a component of a wafer processing chamber, comprising:
placing the component in an ultrasonic conditioning solution in an ultrasonic solution tank;
applying ultrasonic energy through the ultrasonic conditioning solution from a megasonic transducer head to the component to clean the component;
submerging the component in a megasonic conditioning solution in a tank, wherein the submerging the component in the megasonic conditioning solution comprises mounting the component on a mount in the tank;
applying megasonic energy through the megasonic conditioning solution to the component to clean the component; and
flowing the megasonic conditioning solution during the applying megasonic energy; comprising:
flowing the megasonic conditioning solution into the tank at a location below where the component is mounted in the tank, through at least one inlet; and
draining the megasonic conditioning solution from the tank at a location above where the component is mounted in the tank,
wherein at least part of the inlet is under where the component is mounted in the tank;
on a mount in the tank,
wherein the megasonic transducer head is above the component and faces the inlet, wherein the component is between the inlet and the transducer head.