CPC B01B 1/005 (2013.01) [B22F 3/1121 (2013.01); B22F 5/10 (2013.01); B22F 7/002 (2013.01); B22F 7/004 (2013.01); B22F 7/08 (2013.01); B22F 10/16 (2021.01); B22F 10/28 (2021.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 7/20336 (2013.01); H05K 7/20381 (2013.01); A61L 2209/135 (2013.01); B22F 12/53 (2021.01); B22F 2999/00 (2013.01); F28F 2255/18 (2013.01); G06F 2200/201 (2013.01)] | 9 Claims |
1. A method for additive selective laser sintering, comprising:
depositing a first copper powder layer across a substrate;
subsequently selectively fusing the first copper powder layer via a fusing instrument;
depositing a second copper powder layer across the first copper powder layer;
selectively fusing the second copper powder layer via the fusing instrument; and
depositing a plurality of additional copper powder layers wherein each additional layer is deposited on the previous layer;
selectively fusing each of the additional copper powder layers; and
creating a predetermined wick structure based on the selective fusing of each additional copper powder layer,
wherein the predetermined wick structure is a multi-layer wick structure including a wick base layer, a liquid feeding post, and a wick cap layer, the predetermined wick structure being formed by a plurality of wick unit cells, each of the wick unit cells including an arched liquid feeding post, a structure based wick with non-uniform height that is thicker further from the arched liquid feeding post, and a tapered outlet vent, a top end of the arched liquid feeding post being thicker than a bottom end of the arched liquid feeding post.
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