US 12,064,639 B2
Electrical connection for an AIMD utilizing an anisotropic conductive layer
Robert A. Stevenson, Canyon Country, CA (US); Christine A. Frysz, Orchard Park, NY (US); Keith W. Seitz, Clarence Center, NY (US); Brian P Hohl, Clarence, NY (US); and Marc Gregory Martino, Westlake Village, CA (US)
Assigned to Greatbatch Ltd., Clarence, NY (US)
Filed by Greatbatch Ltd., Clarence, NY (US)
Filed on Feb. 2, 2021, as Appl. No. 17/165,500.
Application 17/165,500 is a continuation of application No. 16/362,043, filed on Mar. 22, 2019, granted, now 10,905,888, issued on Feb. 2, 2021.
Application 16/362,043 is a continuation in part of application No. 16/121,716, filed on Sep. 5, 2018, granted, now 10,596,369, issued on Mar. 24, 2020.
Application 16/121,716 is a continuation in part of application No. 15/943,998, filed on Apr. 3, 2018, granted, now 10,350,421, issued on Jul. 16, 2019.
Claims priority of provisional application 62/646,522, filed on Mar. 22, 2018.
Prior Publication US 2021/0154483 A1, May 27, 2021
Int. Cl. A61N 1/375 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/236 (2006.01); H01G 4/35 (2006.01)
CPC A61N 1/3754 (2013.01) [H01G 4/008 (2013.01); H01G 4/1209 (2013.01); H01G 4/236 (2013.01); H01G 4/35 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A feedthrough assembly that is attachable to an active implantable medical device (AIMD), the feedthrough assembly comprising:
a) a feedthrough, comprising:
i) an electrically conductive ferrule extending to a ferrule body fluid side opposite a ferrule device side, the ferrule comprising a ferrule opening;
ii) an insulator hermetically sealed to the ferrule in the ferrule opening, the insulator extending to an insulator body fluid side disposed at or adjacent to the ferrule body fluid side opposite an insulator device side disposed at or adjacent to the ferrule device side, wherein, when the ferrule hermetically sealed to the insulator is attached to an opening in a housing of an AIMD, the ferrule and insulator body fluid sides, and the ferrule and insulator device sides reside outside and inside the AIMD housing, respectively; and
iii) an insulator conductive pathway comprising an insulator conductive pathway body fluid side end disposed at or adjacent to the insulator body fluid side and an insulator conductive pathway device side end disposed at or adjacent to the insulator device side; and
b) a circuit board substrate disposed on or adjacent to the insulator device side of the feedthrough, wherein a circuit board conductive pathway extends through the circuit board;
c) at least one electronic component supported on the circuit board substrate;
d) a circuit board electrical connection material supported by the circuit board substrate, wherein the circuit board electrical connection material is electrically connected to the at least one electronic component and to the circuit board conductive pathway; and
e) an anisotropic conductive layer disposed between the circuit board substrate and the device side of the insulator, the anisotropic conductive layer comprising an electrically insulative matrix supporting a plurality of electrically conductive particles, wherein the anisotropic conductive layer comprises:
i) a first thickness that is longitudinally aligned with either the ferrule or the insulator conductive pathway and with the circuit board conductive pathway electrically connected to the at least one electronic component by the circuit board electrical connection material, wherein the electrically conductive matrix of the anisotropic conductive layer residing in the first thickness has at least a first one of the plurality of electrically conductive particles in electrical contact with either the ferrule or the insulator conductive pathway and with the circuit board conductive pathway; and
ii) a second, greater thickness where the ferrule or the insulator conductive pathway and the circuit board conductive pathway are not longitudinally aligned, wherein, even though the electrically conductive matrix supporting the plurality of electrically conductive particles resides in the second, greater thickness, a second one of the plurality of electrically conductive particles is not in electrical contact with the ferrule or the insulator conductive pathway and the circuit board conductive pathway.