US 12,064,315 B2
Indirect bonding tray system
Louis Schueller, Redwood City, CA (US); Huafeng Wen, Redwood Shores, CA (US); Henry Cao, San Jose, CA (US); Surya Sarva, Fremont, CA (US); and Eric Wu, Palo Alto, CA (US)
Assigned to uLab Systems, Inc., Memphis, TN (US)
Filed by uLab Systems, Inc., Redwood City, CA (US)
Filed on Oct. 18, 2019, as Appl. No. 16/657,639.
Claims priority of provisional application 62/840,559, filed on Apr. 30, 2019.
Prior Publication US 2020/0345459 A1, Nov. 5, 2020
Int. Cl. A61C 7/14 (2006.01)
CPC A61C 7/146 (2013.01) 14 Claims
OG exemplary drawing
 
1. An indirect bonding tray apparatus, comprising:
one or more individual modules each defining a receiving channel for retaining an orthodontic appliance within and configured for placement upon a dentition of a subject;
wherein the one or more individual modules are configured into an arch in which each of the modules is coupled to an adjacent module such that the arch comprises a single contiguous indirect bonding tray apparatus which is configured for placement upon the dentition, and
wherein each of the one or more individual modules defines a flattened occlusal surface which is coplanar with one another such that each of the flattened occlusal surfaces collectively define a common plane over the apparatus, and
wherein each of the one or more individual modules defines an access lumen each of which extends directly through the flattened occlusal surface such that the access lumen is in communication with the receiving channel.