US 12,064,157 B2
Method of performing a balloon kyphoplasty procedure using a scoop cannula
Hester Chan, Sunnyvale, CA (US); Amy L. Arthur, San Jose, CA (US); and Trevor T. Seck, Saint Michael, MN (US)
Assigned to Medtronic Holding Company SARL, Tolochenaz (CH)
Filed by MEDTRONIC HOLDING COMPANY SÀRL, Tolochenaz (CH)
Filed on Mar. 30, 2021, as Appl. No. 17/217,510.
Application 17/217,510 is a continuation of application No. 15/988,544, filed on May 24, 2018, granted, now 11,013,543.
Prior Publication US 2021/0315623 A1, Oct. 14, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 17/88 (2006.01); A61B 17/34 (2006.01)
CPC A61B 17/8811 (2013.01) [A61B 17/3421 (2013.01); A61B 17/3472 (2013.01); A61B 17/8855 (2013.01); A61B 2017/3454 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method comprising:
identifying tissue of a patient;
inserting a cannula having a shaft and a scoop extending from the shaft into the patient such that an outer surface of the scoop faces the tissue, the shaft comprising a first material and the scoop comprising a second material that is different from the first material;
inserting a balloon into the cannula such that the balloon is positioned entirely within the scoop; and
inflating the balloon such that the balloon engages an inner surface of the scoop and expands away from the inner surface as the balloon is inflated, the balloon being spaced apart from the shaft when the balloon is inflated, a portion of the balloon being positioned distal to a distal tip of the scoop when the balloon is inflated.