US 11,737,251 B2
Base tape and electronic component array
Yasuhiro Shimizu, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Oct. 23, 2020, as Appl. No. 17/78,138.
Claims priority of application No. 2019-204692 (JP), filed on Nov. 12, 2019.
Prior Publication US 2021/0144889 A1, May 13, 2021
Int. Cl. H05K 13/02 (2006.01); H05K 9/00 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H05K 13/04 (2006.01)
CPC H05K 9/0079 (2013.01) [H05K 13/02 (2013.01); H01G 2/065 (2013.01); H01G 4/30 (2013.01); H05K 13/0419 (2018.08)] 20 Claims
OG exemplary drawing
 
1. A base tape comprising:
an accommodating section having a rectangular or substantially rectangular parallelepiped shape; and
a surface layer including a carbon layer; wherein
the accommodating section includes a bottom surface portion, a side wall portion including a plurality of surfaces, and an opening portion; and
the side wall portion includes, at at least one surface thereof, a planar portion which is a surface extending from the bottom surface portion to an edge portion located between the bottom surface portion and the opening portion, and an electrical discharge path portion inclined from the edge portion toward the opening portion.