US 11,737,230 B2
Offset control for assembling an electronic device housing
David Pakula, San Francisco, CA (US); Richard Hung Minh Dinh, Saratoga, CA (US); Scott Myers, Saratoga, CA (US); and Tang Yew Tan, Palo Alto, CA (US)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 12, 2022, as Appl. No. 17/943,145.
Application 13/967,636 is a division of application No. 12/794,563, filed on Jun. 4, 2010, granted, now 8,551,283, issued on Oct. 8, 2013.
Application 17/943,145 is a continuation of application No. 17/033,117, filed on Sep. 25, 2020, granted, now 11,464,126.
Application 17/033,117 is a continuation of application No. 16/439,103, filed on Jun. 12, 2019, granted, now 10,842,036, issued on Nov. 17, 2020.
Application 16/439,103 is a continuation of application No. 15/466,739, filed on Mar. 22, 2017, granted, now 10,368,457, issued on Jul. 30, 2019.
Application 15/466,739 is a continuation of application No. 13/967,636, filed on Aug. 15, 2013, granted, now 9,606,579, issued on Mar. 28, 2017.
Claims priority of provisional application 61/325,801, filed on Apr. 19, 2010.
Claims priority of provisional application 61/300,780, filed on Feb. 2, 2010.
Prior Publication US 2023/0007800 A1, Jan. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 1/16 (2006.01); H05K 7/14 (2006.01); H04M 1/02 (2006.01); H05K 5/03 (2006.01); G02B 7/02 (2021.01); H05K 5/00 (2006.01); H04N 23/51 (2023.01); G02B 13/00 (2006.01); B29L 31/34 (2006.01)
CPC H05K 7/14 (2013.01) [G02B 7/02 (2013.01); G06F 1/1626 (2013.01); G06F 1/1637 (2013.01); G06F 1/1656 (2013.01); G06F 1/1658 (2013.01); H04M 1/0202 (2013.01); H05K 5/0086 (2013.01); H05K 5/03 (2013.01); B29L 2031/3481 (2013.01); G02B 13/001 (2013.01); H04M 1/0266 (2013.01); H04N 23/51 (2023.01); Y10T 29/49002 (2015.01); Y10T 156/10 (2015.01)] 18 Claims
OG exemplary drawing
 
1. An electronic device enclosure, comprising:
a front cover comprising a transparent material, the front cover placed and secured to provide a front surface for the electronic device enclosure, the front cover positioned over a touch-screen display and at least a portion of the front cover including a front transparent area;
a front structural member that surrounds the front cover and that is formed from a material different than the transparent material;
an outer periphery member having side surfaces, the side surfaces for the electronic device enclosure being partially formed by the outer periphery member, the outer periphery member formed from a first polymer material;
a back cover placed and secured to provide a back surface for the electronic device enclosure, the back cover positioned over one or more sensors that receive signals through at least a portion of the back cover including a back transparent area; and
a back structural member that surrounds the back cover, the back structural member completely spaced apart from the front structural member,
wherein the front cover, the front structural member, the outer periphery member and the back structural member are separate parts that together form the electronic device enclosure.