US 11,737,213 B2
Card edge connector with intra-pair coupling
Daniel B. Stewart, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Aug. 12, 2022, as Appl. No. 17/887,139.
Application 17/887,139 is a continuation of application No. 16/921,768, filed on Jul. 6, 2020, granted, now 11,425,816.
Prior Publication US 2022/0386462 A1, Dec. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/117 (2013.01) [H05K 2201/10189 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a first contact pin disposed on a layer of an edge connector of the electronic device;
a second contact pin disposed adjacent the first contact pin on a same layer as the first contact pin;
a coupling pad disposed under the first contact pin;
an interposing insulating layer disposed between the coupling pad and the first and second contact pins; and
a coupling trace that electrically connects the coupling pad to the second contact pin.