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1. An electronic component package, comprising: a substrate, comprising a first surface and a second surface opposite to the first surface; wherein the first surface of the substrate is arranged with a first conductive layer, and the second surface of the substrate is arranged with a second conductive layer; the substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer; and a first electronic component, received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole; wherein the first electronic component is a passive electronic component; wherein the substrate comprises a frame and defines a holding slot in the frame; the first electronic component is received in the holding slot and connected to an outside through the first electrical connection terminal.
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