US 11,736,854 B2
Bone conduction earphones
Zhen Wang, Shenzhen (CN); Zhiqing Liu, Shenzhen (CN); Yonggen Wang, Shenzhen (CN); and Xinnan Mao, Shenzhen (CN)
Assigned to SHENZHEN SHOKZ CO., LTD., Shenzhen (CN)
Filed by SHENZHEN SHOKZ CO., LTD., Guangdong (CN)
Filed on Jul. 4, 2022, as Appl. No. 17/810,617.
Application 17/810,617 is a continuation of application No. 17/453,648, filed on Nov. 4, 2021, granted, now 11,388,506.
Application 17/453,648 is a continuation of application No. PCT/CN2021/090958, filed on Apr. 29, 2021.
Claims priority of application No. 202010367107.5 (CN), filed on Apr. 30, 2020; application No. 202020720127.1 (CN), filed on Apr. 30, 2020; and application No. 202020720129.0 (CN), filed on Apr. 30, 2020.
Prior Publication US 2022/0353595 A1, Nov. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04R 1/10 (2006.01)
CPC H04R 1/105 (2013.01) [H04R 2460/13 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A bone conduction earphone, comprising:
an ear hook assembly including an ear hook housing, wherein the ear hook housing includes an earphone fixing portion; and
a core module disposed on one end of the ear hook assembly, the core module including a core housing and a core, and an opening being disposed on one end of the core housing to form a chamber structure for accommodating the core; wherein
the earphone fixing portion is disposed on an opening end of the core housing, and
a reinforcing structure is integrally disposed on the earphone fixing portion, the reinforcing structure being configured to increase rigidity of the earphone fixing portion.