US 11,736,845 B2
Microphone component and method for fabricating microphone component
Pirmin Hermann Otto Rombach, Kongens Lyngby (DK); and Dennis Mortensen, Bagsvard (DK)
Assigned to TDK Corporation, Tokyo (JP)
Filed by TDK Corporation, Tokyo (JP)
Filed on Mar. 19, 2021, as Appl. No. 17/206,297.
Claims priority of application No. 102020108527.3 (DE), filed on Mar. 27, 2020.
Prior Publication US 2021/0306728 A1, Sep. 30, 2021
Int. Cl. H04R 1/08 (2006.01)
CPC H04R 1/08 (2013.01) [H04R 2201/003 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A microphone component comprising:
a membrane; and
a backplate,
wherein the membrane comprises a plurality of holes, the holes having diameters smaller than 5 μm,
wherein the holes are present at least in a central region of the membrane,
wherein the central region has a first radius, and
wherein a number of holes per surface area in the central region is less than a number of holes per surface area in a region adjoining the central region.