CPC H04R 1/04 (2013.01) [H01Q 1/241 (2013.01); H04R 1/1016 (2013.01); H04R 1/1041 (2013.01); H01Q 9/0421 (2013.01)] | 13 Claims |
1. An earphone module, comprising:
a first circuit board, comprising;
a touch panel layer;
a grounding layer disposed apart from and below the touch panel layer;
an antenna layer comprising an antenna flat portion, an antenna feed wire, and an antenna short-circuit wire, wherein the antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion; and
a touch circuit layer assembly disposed apart from and below the antenna flat portion and comprising a touch chip, wherein the touch panel layer is electrically connected to the touch chip.
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