US 11,736,844 B2
Earphone module
Jui-Hsien Chien, Taichung (TW); Wan-Hsuan Weng, Taichung (TW); and Ying-Ying Peng, Taichung (TW)
Assigned to Merry Electronics Co., Ltd., Taichung (TW)
Filed by Merry Electronics Co., Ltd., Taichung (TW)
Filed on Feb. 15, 2022, as Appl. No. 17/671,617.
Claims priority of application No. 111102049 (TW), filed on Jan. 18, 2022.
Prior Publication US 2023/0232142 A1, Jul. 20, 2023
Int. Cl. H04R 1/10 (2006.01); H04R 1/04 (2006.01); H01Q 1/24 (2006.01); H01Q 9/04 (2006.01)
CPC H04R 1/04 (2013.01) [H01Q 1/241 (2013.01); H04R 1/1016 (2013.01); H04R 1/1041 (2013.01); H01Q 9/0421 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An earphone module, comprising:
a first circuit board, comprising;
a touch panel layer;
a grounding layer disposed apart from and below the touch panel layer;
an antenna layer comprising an antenna flat portion, an antenna feed wire, and an antenna short-circuit wire, wherein the antenna flat portion is disposed apart from and below the grounding layer, and the antenna feed wire and the antenna short-circuit wire are connected to the antenna flat portion; and
a touch circuit layer assembly disposed apart from and below the antenna flat portion and comprising a touch chip, wherein the touch panel layer is electrically connected to the touch chip.