US 11,736,156 B2
MIMO antenna assembly having stacked structure
Duk Yong Kim, Hwaseong-si (KR); Bae Mook Jeong, Hwaseong-si (KR); Chang Woo Yoo, Hwaseong-si (KR); Young Chan Moon, Hwaseong-si (KR); Nam Shin Park, Hwaseong-si (KR); Bum Sik Park, Hwaseong-si (KR); Min Seon Yun, Hwaseong-si (KR); Min Sik Park, Hwaseong-si (KR); and Sung Ho Jang, Hwaseong-si (KR)
Assigned to KMW INC., Hwaseong-si (KR)
Filed by KMW INC., Hwaseong-si (KR)
Filed on Jul. 4, 2021, as Appl. No. 17/367,364.
Application 17/367,364 is a continuation of application No. 16/412,426, filed on May 15, 2019, granted, now 11,088,731.
Application 16/412,426 is a continuation of application No. PCT/KR2017/013034, filed on Nov. 16, 2017.
Claims priority of application No. 10-2016-0152609 (KR), filed on Nov. 16, 2016; application No. 10-2017-0028430 (KR), filed on Mar. 6, 2017; application No. 10-2017-0028434 (KR), filed on Mar. 6, 2017; and application No. 10-2017-0028442 (KR), filed on Mar. 6, 2017.
Prior Publication US 2021/0336659 A1, Oct. 28, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 7/0413 (2017.01); H01Q 3/26 (2006.01); H01Q 21/00 (2006.01); H01Q 21/06 (2006.01); H01Q 21/29 (2006.01); H01Q 25/00 (2006.01); H01Q 1/02 (2006.01); H01Q 1/42 (2006.01); H01R 12/73 (2011.01)
CPC H04B 7/0413 (2013.01) [H01Q 3/267 (2013.01); H01Q 21/0006 (2013.01); H01Q 21/065 (2013.01); H01Q 21/29 (2013.01); H01Q 25/001 (2013.01); H01Q 1/02 (2013.01); H01Q 1/42 (2013.01); H01R 12/73 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multiple-input multiple-output (MIMO) antenna system comprising:
a radome;
a housing including a heat sink on a rear side thereof; and
an antenna assembly having a stacked structure and embedded between the radome and the housing,
wherein the antenna assembly comprises:
a first printed circuit board (PCB) on which a feeding network is provided;
a plurality of antenna elements provided on an upper surface of the first PCB,
and electrically connected to the feeding network;
a second PCB arranged under the first PCB, the second PCB including:
a plurality of transmitting and receiving circuits; and
a digital circuit being configured to perform digital processing on a baseband signal and electrically connected to the plurality of transmitting and receiving circuits; and
a filter assembly disposed between the first PCB and the second PCB, the filter assembly including the plurality of band-pass filters which are assembled in a line on a push bar,
wherein a filter body of each of the plurality of band-pass filters is attached to the first PCB, and a first port of each of the plurality of band-pass filters is directly connected to the feeding network without radio-frequency (RF) cabling, and
wherein, when the push bar is fastened to the second PCB, a second port of each of the plurality of band-pass filters is directly connected to one of the transmitting and receiving circuits without RF cabling.